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  15 allied components interna tional 714-665-1 140 www.a lli edcom pon en ts .com rohs revised 06/08/09 high current beads hcb10 allied part number impedance (?) @ 100 mhz +/- 25% dc resistance (?) max. rated current (ma) hcb10 all specif icat ions subject t o change wit hout not ice. hcb10-110-rc hcb10-170-rc hcb10-300-rc hcb10-500-rc hcb10-600-rc hcb10-800-rc hcb10-131-rc HCB10-201-RC hcb10-301-rc hcb10-102-rc 11 17 30 50 60 80 130 200 300 1000 0.01 0.02 0.02 .025 0.03 0.04 0.05 0.05 0.08 0.12 6000 5000 4000 3000 3000 3000 2500 2500 2000 1500 hcb10 0.0790.008 (2.010.20) 0.0490.008 (1.240.20) 0.0350.008 (0.890.20) 0.0200.012 (0.510.30) 0.047 (1.19) 0.045 (1.14) 0.039 (0.99) dimensions: inches (mm) hcb10-050-rc hcb10-070-rc 5 7 0.01 0.01 6000 6000 hcb10-150-rc 15 0.02 5000 hcb10-130-rc 13 0.02 5000 hcb10-190-rc hcb10-280-rc 19 28 0.02 0.02 4000 4000 hcb10-260-rc 26 0.02 4000 hcb10-220-rc 22 0.02 4000 hcb10-310-rc hcb10-420-rc 31 42 0.02 .025 4000 3000 hcb10-320-rc hcb10-400-rc 32 40 0.02 0.02 4000 3000 hcb10-390-rc 39 0.02 3000 hcb10-330-rc 33 0.02 4000 hcb10-700-rc hcb10-750-rc 70 75 0.04 0.04 3000 3000 hcb10-121-rc 121 0.04 hcb10-900-rc hcb10-101-rc 90 100 0.04 0.04 3000 3000 3000 hcb10-181-rc 180 0.05 2500 hcb10-151-rc 150 0.05 2500 hcb10-251-rc 250 0.08 2000 hcb10-241-rc 240 0.08 2000 hcb10-221-rc 220 0.08 2000 hcb10-401-rc hcb10-601-rc 400 600 0.10 0.10 2000 2000 hcb10-391-rc 390 0.10 2000 hcb10-501-rc 500 0.10 2000 hcb10-471-rc 470 0.10 2000 hcb10-451-rc 450 0.10 2000 hcb10-751-rc 750 0.12 1500 hcb10-152-rc 1500 0.30 1000 hcb10-331-rc 330 0.08 2000 electrical impe dan ce range: 5 to 1500 tolerance: 25% over entire range resistance to solder heat pre-heat 150oc, 1 minute solder composition: sn/ag3.0/cu0.5 solder temp: 2605oc for 10sec 1 sec. minimum of 75% of electrode covered with new solder. test equipment physical packaging: 4000 per 7 inch reel. marking: none (z): hp4291a rf impedance/material analyzer (rdc): chen hwa 502bc impedance within 30% of initial value. operating temp: -55oc ~ +125oc rate current: based on temp rise not to exceed 30oc rate current is derated as indicated below based on operating temp. features ? surface mount emi suppression components ? nickel barrier termination for excellent resistance to solder heat ? high current capacity ? wide range of impedance values ? multi layer technology ? low dcr ? flow and reflow soldering storage temp: under 25oc at 40~60% humidity


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